Polyplastics has developed and launched sales of the new “LH” and “TF” polymer series of its liquid crystal polymer LAPEROS^® LCP to meet the electronic component market's growing demands for higher performance and miniaturization.

This series will accelerate expansion into a wide range of applications and next-generation product development through two distinct design approaches: versatility in meeting diverse design needs and high flowability.

■Liquid Crystal Polymer LAPEROS^® LCP

LAPEROS^® LCP excels in heat resistance and mechanical strength, maintaining strength even in thin-walled molding. Its linear expansion coefficient, close to that of molds, makes it ideal for electronic components requiring dimensional accuracy. 

These properties are driving its adoption in next-generation high-speed transmission uses, such as ultra-thin fine-pitch connectors for smartphones and tablet devices. 

■LH Series

The LH series has very well-balanced performance, combining flowability, mechanical properties, and heat resistance.　Its adaptability allows it to accommodate a broad range of product designs, making it suitable for various electronic component applications.

■TF Series

The TF series is engineered for exceptional fluidity for better molding of complex geometries found in smartphones and precision electronic components. While maximizing flowability, it also maintains excellent mechanical properties and a wide molding window*1, providing materials that support miniaturization and high-density integration in electronic devices.

*1: The “molding window” refers to the allowable range of molding conditions (such as temperature and pressure), which is a critical factor for manufacturing stability and yield.

Figure 1: Flowability of LAPEROS® LCP “LH” and “TF” Series

■Innovation Through Materials Informatics

Polyplastics leverage Materials Informatics*² in polymer development. By analyzing extensive material data accumulated over many years, Polyplastics derive optimal properties, enabling shorter development cycles and highly precise designs. Polyplastics’ data-driven approach accelerates exploration of new applications and next-generation material development.

*2: “Materials Informatics” refers to methods that utilize AI and data analysis to streamline materials development.

■Advancing LAPEROS^® LCP for the Next Generation

Produced in Japan and Taiwan region, LAPEROS^® LCP has an annual production capacity of 20,000 tons and holds a 34% share of the global market (according to Fuji Keizai 2025 report). It has long supported advancements in the electronic components sector.

The newly introduced LH and TF series offer two distinct characteristics—versatility for multi-purpose design and high fluidity—meeting diverse needs in electronic component applications.

Moving forward, Polyplastics will continue to advance high-quality and high-efficiency products through the development of high-performance engineering plastics that integrate cutting-edge material technology with digital methodologies such as Materials Informatics. Polyplastics are also committed to reducing material usage, energy consumption, and environmental impact